About INOS

INOS (Intelligent Networked Optical Sensor) tackles the design, implementation and prototyping of an intelligent miniaturized optic sensor, capable of acquiring, storing, processing and transmitting still images, video data and/or analysis results based on the images acquired.

Improving highly innovative packaging technology and by embedding into a single package necessary sensing, processing, storage, control and wireless networking subsystems, a true system-in-a package with intelligent multi-sensory abilities is developed.

INOS will connect to standard wireless interfaces (i.e. 802.11x and/or Bluetooth). It will be able to deliver raw or processed data customizable according to the client system’s needs (i.e. M-JPEG, video streams, GIF, TIFF, JPEG still images and/or analysis results i.e. number of counted people). INOS’ software and operating system can be customized after it has been installed into the overall system. It also can take over control functions.

Cost will be reduced significantly by creating a highly integrated product, eliminating the need for separate packaging of included components. Optimizing the cost benefit INOS will be miniaturized. By using state of the art silicon blocks, the cost as well as power consumption of image and video acquisition systems is held at a minimum. Finally the versatility, integration and ease of installation and use of such systems are increased, basing the operating system on open source Linux.

These improvements, augmented with increased processing capabilities, wireless network interfaces and integrated S/W applications, will allow the introduction and seamless integration of visual sensing to ANY IT device ANYWHERE, thus adding visual sensory capability to ambient intelligence.

The project will deliver a complete system level prototype, and techno-economic studies on advanced packaging technologies and design methodologies for wireless system in a package.

Key Innovations and Benefits of INOS:

· Highly integrated packaging of fully functional camera

· Highly cost efficient packaging

o By eliminate the need for separate packages

o Cost efficient miniaturization, the used packaging technology will yield the smallest package given the components integrated

o By using patented RMPD technology

· Integrate Intelligence together with image sensor in one package

· Highly flexible and easy-to-use

o INOS can be integrated into wireless and wired networks

o Software can be customized even after INOS has been integrated in above networks

o Based on open source Linux OS ensuring availability of low cost software infrastructure and support environment

Figure 1: INOS

INOS will serve primarily the growth market of security surveillance systems. Complementary, market segments will be evaluated and served (i.e. integration into mobile phones, PDA’s, watches etc.). INOS target price will aim to significantly decrease current manufacturing cost of about 100 to 150 Euros for applications offering significantly less functionality and benefits. INOS will reinforce European strengths in advanced packaging by taking integration of functionalities into a single package to the next level. Furthermore, it ensures that the partners develop processes for future product evolutions.

The INOS component will most likely have a cylindrical shape and roughly estimated package dimensions of ø 22 x 10 mm (with ½ inch CMOS Sensor) or ø 15 x 12 mm (with ¼ inch CMOS sensor). This estimate does not take into account many variables that will be assessed and researched during the course of the project. The largest die determines the diameter. Depending on the resolution requirements defined during the project, the CMOS sensor might be the largest die within the package. Unlike traditional packaging technologies, within INOS dies and other components can be packaged without being limited to a layer structure in a 3D approach. However, in order to better explain and roughly draft a layout a possible layer structure could be described as follows:

· Layer 1: Lens

· Layer 2: CMOS sensor maximum dimensions 14 x 11 mm

· Layer 3: INOS-Digital (CPU, Image processing etc.) probably not exceeding dimensions of CMOS sensor around 10 x 10 mm

· Layer 4: ROM/Flash: about 4 MB also smaller than 10 x10 mm (D)RAM 16 MB: also smaller than 10 x10 mm

· Layer 5 INOS (WLAN) BB WLAN MAC/BB IC: 6,3 X 6,3 mm, 68-172 pins, depending on host interface

· Layer 6: INOS RF, WLAN RF IC: 4 X 4 mm, + passives (SMD or the like) + BT RF

· Layer 7, 8 and 9: Power Regulator 2 x 2 mm, Ethernet PHYs: about 2 x 2 mm each, other analog parts, transistors, inductivity + PA (external, packaged component + Antenna switch (external component), Connectivity